Manufacture semiconductor IC packages, hybrid
modules and microelectronic products. Thick film
Technology was also introduced in October 2001 to
further enhance capabilities and meet growing market
and customer needs. Tong Hsing Electronics (Phils),
Inc. is one of the leading IC hybrid assembly houses
specializing on Chip Scale Package (CSP), Land Grid
Array (LGA) packages, Quad Flat No Leads (QFN), Dual
Flat No Leads (DFN), High Reliability Products, and
other devices such as PCB assembly with Surface
Mount Technology (SMT) and Chip On Board (COB)
processes, Multi Chip Modules especially on RF
Modules, Image Sensors and Thick Film Assembly.
The company also specializes in Direct Plated Copper
(DPC) Ceramic Substrates. Cleanroom environment
ranges from class 10, class 100, class 10K and class
100K.m class 10, class 100, class 10K and class 100K