A 100%
Filipino company. Team Pacific Corp. is a recognized
leader in offshore product development &
manufacturing for high-performance power
semiconductor packages & metal cans. TEAM also co-
develops new packages & leadframe designs for
several partner manufacturers of electronics and
semiconductors worldwide. Equipped with over 20
years of eng’g experience, the company customizes
innovative packaging solutions for both standard &
complex devices, most notably for the large power
packing requirements of industrial and automotive
applications.
TO-247,
TO-264,
SOT-227,
EXT SOT-227,
VPMP1-6,
TO-3,
TO-5,
TO-39,
TO-46 /
TO-18 /
TO-72
Assembly and Test of
Semiconductor Devices