STMicroelectronics Packaging and Test plant located
50 kilometers south of Manila in Calamba City,
Philippines, established its operations in January
1999.This state-of-the-art facility forms part of ST’s
strategic network of front and back-end manufacturing
sites that span Europe and Asia, supplying timely high-
volume silicon solutions to our customers globally. The
ST plant in Calamba is a sophisticated complete
service Packaging and Test facility.
Specific Products:The plant handles a broad range of
products including connectivity, displays, sensors,
digital video, power management, RF transceivers,
identification, automotive, and near field
communications. It is also playing an important role in
advancing packaging technology such as the migration
of gold to copper wiring as well as higher-value
System-in-Package solutions.
– Assembly Package
– Test (Final Test and Wafer Test)
– Package Development
– Test Development
– Wafer Bumping/ Flip‐Chip Technology
– Failure Analysis and Reliability Engineering
– RF Competency