MME TECHNOLOGIES, INC.
0.000
Company Information

Provider of

Electronics Manufacturing Services (EMS). Offers full-
Service Contract Printed Circuit Board Assemblies on

rigid or flexible boards using both Surface Mount and
Thru Hole Technologies.
Accepts both “low mix-high volume” and “high mix –
low volume production using international standards
on green technology towards Lead Free (Pb-free) and
RoHS compliance. Also accepts prototype or new

product introduction or evaluation runs in short-
leadtime/turn-around time. Other special services

offered includes delicate Wafer-Back-Coating process

using Minami OEM Wafer Screen Printer with Wafer-
handling systems capabilities.

Specific Products –Automotive Electronics (Car
Infotainment Assemblies), Consumer Electronics
assemblies, Audio Electronics (MP3) Board Assemblies,

Medical Electronics, Camera Electronics,

Communications Electronics, Wafer Conductive/Non-
Conductive Material Back-coatings. Gaming Console

 

Major Product Lines

Services Offered:
* Surface Mounting Assemblies (BGA, CSP, QFNs,
Odd-shaped-components, 0201/0603 chips, Die
mounting) inside Class 100K cleanroom environment.
* RoHS Compliant /Lead Free / Leaded Reflow
Technologies
* Nitrogen / Air Reflow Systems, Hot Air Systems
* Manual assemblies / Complete Box Assemblies
* Repair and Reworks/ Hand Soldering Services (SMT,
Thru-Hole, FR4/PCB/Ceramic Substrates)/ 0201/0603
chipsizes Inside Class 1K/10K/100K Cleanroom
Environment
* X-ray inspection / Automatic Optical Inspection
Capabilities/ Microscopes/Magnifying Inspection and
Sorting Services
*Quick-Turnaround Production Runs:
Prototyping/New Product
introduction/evaluation/Test Runs

* Wafer Back-coating Services using Conductive/Non-
conductive materials Inside Class 1K/10K Cleanroom

Contact Information
Address

Author Gen Javid