Power Device
(semi-conductor) manufacturing employing basic
operations/process that include wafer chip singulation
and inspection chip (die) and aluminum wire
attachments, plastic molding with epoxy resin,
deflashing, unit singulation, lead soldering & tin plating
for MP2, electrical characteristics testing, final
inspection, packing and shipment of finished products.
Approximately using one hundred seventy two (172)
different kinds of machines such as Wafer Saw, Die
Bonder, Wire Bonder, Molding Machine, Deflashing
Machine, Cutting, Solder Dipping, Isolation Testing
Machine, Tin Plating, Drying and Test Handler.