Amkor is one
of the largest providers of contract semiconductor
assembly & test services
Specific Products:Micro Leadframe, Flip Chip,
System-in-Package, Cavity MEMs, Ball Grid Arrays
(BGA), TQFP, MQFP, TSSOP, SSOP, SOIC, PDIP,
PLCC, PSOP, MSOP, SOJ, SOT, Die Sales, Hermetics
Packages, Power QFN, Stacked CSP, Touch Chip &
Area Sensors
Services Offered: Assembly of Semiconductor
Packages; Test (singulated test, probe, burn-in,
Striptest, Tape and Reel, Dropshipment) High
Parallelism MLF FilmFrame Testing; Test Solutions
and Hardware and Software Development.
Certification(s): OHSAS-18001, ISO-14001,
ISO9001,IATF16949, DSCC Lab Suitability, DSCC/QML
MIL-PRF-38535